Characterisation and Integration of Materials and Processes for Planar Spiral Microinductors with Permalloy Cores
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چکیده
ii temperature deposition process. However, the test-bed inductor process requires thermal treatments up to 140°C. Hence it was necessary to characterise the stress in Parylene films as a result of processing temperature and compare this to stress levels in SU-8 5 and 3005 films. This study has determined the spatial variation of residual stress in Parylene-C and SU-8 films, by combining automated measurements of strain indicator test structures and local nanoindentation measurements of Young’s modulus. These measurements have been used to wafer map strain, Young’s modulus, and subsequently residual stress in these films, as a result of processing parameter variation. It is well known that placing ferromagnetic material in close proximity to current carrying coils can further enhance the measured inductance value. However, the conductive magnetic core is also a source of loss for the microinductor. Hence, magnetic permeability, electrical resistivity and mechanical stress in the magnetic core influence the inductance value, eddy current losses and reliability of the fabricated microinductor, respectively. The ability to characterise these properties on wafer is essential for process control and verification measurements. This thesis details a test chip capable of routine measurements on NiFe films to characterise the spatial variation of these properties. Furthermore, wafer mapping measurements are reported to identify the correlation between high frequency permeability, electrical resistivity, mechanical strain and the chemical composition of two-component Permalloy film (NixFe(100-x)) electroplated on the surface of 100mm silicon wafers. Finally, MEMS-based inductor fabrication processes typically require a number of electrodeposition steps, which require conductive seed layers for the deposition of the coils and magnetic core material. A typical choice of seed layer is copper. However, due to copper’s paramagnetic behaviour (μ = 1) and low electrical resistivity (ρ=6.69μΩ.cm) this layer contributes to eddy current losses, while acting as a thin ‘screening layer’. It is very likely that using a magnetic seed layer, within the magnetic core, will noticeably reduce eddy current related losses. However, detailed systematic experimental studies on any such improvement have not been documented in the literature. This study involves compositional, structural, electrical and magnetic characterisation of Ni80Fe20 films electro-deposited on non-magnetic and magnetic
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تاریخ انتشار 2017